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November 21, 2006

Herbst LaZar Bell Inc. Announces Opening of Bell Lab 3D Studio

posted by at 11:43 AM

Chicago, IL. – Herbst LaZar Bell Inc. (HLB), the internationally recognized product development firm, recently announced the opening of their new in-house Bell Lab 3D Studio. This new amenity, named after co-founder Randy Bell on the heels of his retirement, is not simply a prototype “shop,” but a facility that will provide a dedicated space for the development of complex design projects.

“As HLB finds itself with more challenging development programs, we have lacked the appropriate space to invent, build and test concepts,” stated Dan Peterson, Director of Program Management for HLB. “To that end, we have remodeled the old space to provide a more inviting and inventive facility.”

While the previous shop was focused on creating a range of models from visuals to functional breadboards, the Bell Lab is geared toward hands-on mechanical and design development work. The studio provides tools and resources for brainstorming and ideation exercises that can be accompanied with simultaneous hands-on 3D work, allowing designers and engineers to work directly on projects as they invent, innovate and build all in the same space.

HLB has upgraded the physical layout of the studio, making it more functional and easier to use. They have separated the “chip making” side from the “build” side, which will facilitate an environment that is cleaner and more organized. The chip side contains milling and machining equipment for fabricating and modifying prototype parts, while the build side features three large workstations equipped with tools and equipment for mechanical development and prototype assembly. Additionally, the floor plan was opened up to give adequate space for larger, more complex development programs and mechanical prototype construction.

The Bell Lab remodeling is the first phase of a multi-stage project that will include future updating of the chip side of the studio, upgrading the Industrial Design workspace for 3D form development (i.e. foam and light material models), and improving the Electrical Engineering Lab facilities.